top of page

Packaging Services:

  • Wafer Dicing.
  • Die Attach and Flip Chip Bonding.
  • Au/Al Ball and Wedge Wire Bonding.
  • Ceramic/Glass Lids.
  • Wafer Bonding.
20190625_102624.jpg
20190625_102221.jpg
LRM_EXPORT_5978666226608_20190729_114909

SERVICES

bottom of page